LIS331DL View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

LIS331DL

MEMS motion sensor 3-axis - ±2g/±8g smart digital output “nano” accelerometer

STMicroelectronics 

Package information

9

Package information

LIS331DL

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second Level Interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK® is an ST trademark.

ECOPACK® specifications are available at: www.st.com.

Figure 25. LGA 16: Mechanical data and package dimensions

Dimensions

mm

inch

Ref.

Min. Typ. Max. Min. Typ. Max.

A1

1.000

0.0394

A2

0.785

0.0309

A3

0.200

0.0079

D1 2.850 3.000 3.150 0.1122 0.1181 0.1240

E1 2.850 3.000 3.150 0.1122 0.1181 0.1240

L1

1.000 1.060

0.0394 0.0417

L2

2.000 2.060

0.0787 0.0811

N1

0.500

0.0197

N2

1.000

0.0394

M 0.040 0.100 0.160 0.0016 0.0039 0.0063

P1

0.875

0.0344

P2

1.275

0.0502

T1 0.290 0.350 0.410 0.0114 0.0138 0.0161

T2 0.190 0.250 0.310 0.0075 0.0098 0.0122

d

0.150

0.0059

k

0.050

0.0020

Outline and

mechanical data

LGA16 (3x3x1.0mm)

Land Grid Array Package

40/42

7983231

Share Link: