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LIS3DSHTR View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
LIS3DSHTR Datasheet PDF : 53 Pages
First Prev 51 52 53
LIS3DSH
9
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 12. LGA-16: mechanical data and package dimensions
D im ensions
mm
inch
R ef.
M in. Typ. M ax. M in. Typ. M ax.
A1
1.000
0.0394
A2
0.785
0.0309
A3
0.200
0.0079
D1 2.850 3.000 3.150 0.1122 0.1181 0.1240
E1 2.850 3.000 3.150 0.1122 0.1181 0.1240
L1
1.000 1.060
0.0394 0.0417
L2
2.000 2.060
0.0787 0.0811
N1
0.500
0.0197
N2
1.000
0.0394
M 0.040 0.100 0.160 0.0016 0.0039 0.0063
P1
0.875
0.0344
P2
1.275
0.0502
T1 0.290 0.350 0.410 0.0114 0.0138 0.0161
T2 0.190 0.250 0.310 0.0075 0.0098 0.0122
d
0.150
0.0059
k
0.050
0.0020
O utline and
m echanicaldata
LGA-16 (3x3x1.0mm)
Land Grid Array Package
Doc ID 022405 Rev 1
7983231
51/53

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