Electrical characteristics
STM32F101x4, STM32F101x6
Table 6. Current characteristics
Symbol
Ratings
Max.
Unit
IVDD
Total current into VDD/VDDA power lines (source)(1)
150
IVSS
Total current out of VSS ground lines (sink)(1)
150
Output current sunk by any I/O and control pin
IIO
Output current source by any I/Os and control pin
25
− 25
mA
IINJ(PIN)(2)
Injected current on five volt tolerant pins(3)
Injected current on any other pin(4)
-5/+0
±5
ΣIINJ(PIN)
Total injected current (sum of all I/O and control pins)(5)
± 25
1. All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power
supply, in the permitted range.
2. Negative injection disturbs the analog performance of the device. See note in Section 5.3.17: 12-bit ADC
characteristics.
3. Positive injection is not possible on these I/Os. A negative injection is induced by VIN<VSS. IINJ(PIN) must
never be exceeded. Refer to Table 5: Voltage characteristics for the maximum allowed input voltage
values.
4. A positive injection is induced by VIN>VDD while a negative injection is induced by VIN<VSS. IINJ(PIN) must
never be exceeded. Refer to Table 5: Voltage characteristics for the maximum allowed input voltage
values.
5. When several inputs are submitted to a current injection, the maximum ΣIINJ(PIN) is the absolute sum of the
positive and negative injected currents (instantaneous values).
Table 7. Thermal characteristics
Symbol
Ratings
TSTG
TJ
Storage temperature range
Maximum junction temperature
Value
Unit
–65 to +150
°C
150
°C
5.3
5.3.1
Operating conditions
General operating conditions
Table 8. General operating conditions
Symbol
Parameter
Conditions
Min
fHCLK Internal AHB clock frequency
0
fPCLK1 Internal APB1 clock frequency
0
fPCLK2 Internal APB2 clock frequency
0
VDD
Standard operating voltage
2
VDDA(1)
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
2
Must be the same potential
as VDD(2)
2.4
VBAT Backup operating voltage
1.8
Max
36
36
36
3.6
3.6
3.6
3.6
Unit
MHz
V
V
V
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Doc ID 15058 Rev 5