STM32F101X6 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F101X6

Low-density access line, ARM-based 32-bit MCU with 16 or 32 KB Flash, 5 timers, ADC and 4 communication interfaces

STMicroelectronics 

STM32F101x4, STM32F101x6

Electrical characteristics

5.3.2

Table 8. General operating conditions (continued)

Symbol

Parameter

Conditions

Min Max Unit

PD

Power dissipation at TA =

85 °C(3)

LQFP64

LQFP48

VFQFPN36

444

363 mW

1000

TA

Ambient temperature

Maximum power dissipation –40 85

°C

Low power dissipation(4)

–40 105

°C

TJ

Junction temperature range

–40 105

°C

1. When the ADC is used, refer to Table 42: ADC characteristics.

2. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV

between VDD and VDDA can be tolerated during power-up and operation.

3. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.2: Thermal

characteristics on page 74).

4. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see

Table 6.2: Thermal characteristics on page 74).

Operating conditions at power-up / power-down

Subject to general operating conditions for TA.

Table 9. Operating conditions at power-up / power-down

Symbol

Parameter

Conditions

Min

VDD rise time rate

0

tVDD

VDD fall time rate

20

Max Unit

∞

µs/V

∞

5.3.3

Embedded reset and power control block characteristics

The parameters given in Table 10 are derived from tests performed under the ambient

temperature and VDD supply voltage conditions summarized in Table 8.

Doc ID 15058 Rev 5

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