STM32F101C4T6ATR View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STM32F101C4T6ATR

Low-density access line, ARM-based 32-bit MCU with 16 or 32 KB Flash, 5 timers, ADC and 4 communication interfaces

STMicroelectronics 

Package characteristics

STM32F101x4, STM32F101x6

6.2

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 8: General operating conditions on page 30.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

● TA max is the maximum ambient temperature in °C,

● ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

● PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

● PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 51. Package thermal characteristics

Symbol

Parameter

Thermal resistance junction-ambient

LQFP 64 - 10 x 10 mm / 0.5 mm pitch

Thermal resistance junction-ambient

LQFP 48 - 7 x 7 mm / 0.5 mm pitch

ΘJA

Thermal resistance junction-ambient

VFQFPN 48 - 7 x 7 mm / 0.5 mm pitch

Thermal resistance junction-ambient

VFQFPN 36 - 6 x 6 mm / 0.5 mm pitch

Value

45

55

16

18

Unit

°C/W

6.2.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org.

74/79

Doc ID 15058 Rev 5

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