LPC2364 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
LPC2364 Datasheet PDF : 69 Pages
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NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
9. Thermal characteristics
The average chip junction temperature, Tj (C), can be calculated using the following
equation:
Tj = Tamb + PD Rthj – a
(1)
• Tamb = ambient temperature (C),
• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)
• PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 6. Thermal characteristics
VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified;
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tj(max)
maximum junction
temperature
-
-
125
C
Table 7. Thermal resistance value (C/W): ±15 %
VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified;
LQFP100
TFBGA100
ja
ja
JEDEC (4.5 in 4 in)
JEDEC (4.5 in 4 in)
0 m/s
37.3
0 m/s
53.9
1 m/s
32.2
1 m/s
45.5
2.5 m/s
29.5
2.5 m/s
39.5
Single-layer (4.5 in 3 in)
8-layer (4.5 in 3 in)
0 m/s
54.4
0 m/s
44.3
1 m/s
42.9
1 m/s
39.2
2.5 m/s
38.8
2.5 m/s
34.2
jc
6.7
jc
9.4
jb
12
jb
10.8
LPC2364_65_66_67_68
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
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