LT6200CS8-10-TRPBF View Datasheet(PDF) - Linear Technology
Part Name
Description
Manufacturer
LT6200CS8-10-TRPBF
Linear Technology
LT6200CS8-10-TRPBF Datasheet PDF : 26 Pages
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LT6200/LT6200-5
LT6200-10/LT6201
APPLICATIONS INFORMATION
200°C/W, θJA. Operating on ± 5V supplies driving 50Ω
loads, the worst-case power dissipation is given by:
PD(MAX) = (10 • 23mA) + (2.5)2/50
= 0.23 + 0.125 = 0.355W
The maximum ambient temperature that the part is
allowed to operate is:
TA = TJ – (PD(MAX) • 200°C/W)
= 150°C – (0.355W • 200°C/W) = 79°C
To operate the device at a higher ambient temperature,
connect more metal area to the V – pin to reduce the thermal
resistance of the package, as indicated in Table 1.
DD Package Heat Sinking
The underside of the DD package has exposed metal
(4mm2) from the lead frame where the die is attached.
This provides for the direct transfer of heat from the die
junction to printed circuit board metal to help control the
maximum operating junction temperature. The dual-in-line
pin arrangement allows for extended metal beyond the
ends of the package on the topside (component side) of
a PCB. Table 2 summarizes the thermal resistance from
the die junction-to-ambient that can be obtained using
various amounts of topside metal (2oz copper) area. On
multilayer boards, further reductions can be obtained using
additional metal on inner PCB layers connected through
vias beneath the package.
Table 2. LT6200 8-Lead DD Package
COPPER AREA
TOPSIDE (mm2)
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
4
160ºC/W
16
135ºC/W
32
110ºC/W
64
95ºC/W
130
70ºC/W
The LT6200 amplifier family has thermal shutdown to
protect the part from excessive junction temperature.
The amplifier will shut down to approximately 1.2mA
supply current per amplifier if the maximum temperature
is exceeded. The LT6200 will remain off until the junction
temperature reduces to about 135°C, at which point the
amplifier will return to normal operation.
62001fd
22
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