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LTC2274I(RevB) View Datasheet(PDF) - Linear Technology

Part Name
Description
Manufacturer
LTC2274I
(Rev.:RevB)
Linear
Linear Technology 
LTC2274I Datasheet PDF : 40 Pages
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LTC2274
PIN FUNCTIONS
VDD (Pins 1, 2, 12, 13 ): Analog 3.3V Supply. Bypass to
GND with 0.1μF ceramic chip capacitors.
GND (Pins 3, 6, 7, 8, 11, 14, 21, 26, 27, 30, 37, 40):
ADC Power Ground.
AIN+ (Pin 4): Positive Differential Analog Input.
AIN– (Pin 5): Negative Differential Analog Input.
ENC+ (Pin 9): Positive Differential Encode Input. The
sampled analog input is held on the rising edge of ENC+.
This pin is internally biased to 1.6V through a 6.2kΩ resistor.
Output data can be latched on the falling edge of ENC+.
ENC(Pin 10): Negative Differential Encode Input. The
sampled analog input is held on the falling edge of ENC-.
This pin is internally biased to 1.6V through a 6.2kΩ
resistor. Bypass to ground with a 0.1uF capacitor for a
single-ended Encode signal.
DITH (Pin 15): Internal Dither Enable Pin. DITH = low
disables internal dither. DITH = high enables internal dither.
Refer to Internal Dither section of this data sheet for details
on dither operation.
ISMODE (Pin 16): Idle Synchronization mode. When IS-
MODE is not asserted, synchronization is performed with
a series of COMMAS (K28.5). When ISMODE is asserted,
a special Idle SYNC mode is enabled where synchroniza-
tion is performed by sending a COMMA (K28.5) followed
by the appropriate data code-group (D5.6 or D16.2) for
establishing a negative running disparity for the first data
code-group after synchronization.
SRR0 (Pin 17): Sample Rate Range Select Bit0. Used with
the SRR1 pin to select the sample rate operating range.
SRR1 (Pin 18): Sample Rate Range Select Bit1. Used with
the SRR0 pin to select the sample rate operating range.
SHDN (Pins 19, 20): Shutdown Pins. A high level on both
pins will shut down the chip.
OVDD (Pins 22, 25): Positive Supply for the Output Drivers.
This supply range is 1.2V to VDD for directly coupled CML
outputs, or 1.4V to OVDD for AC-coupled or differentially
terminated CML outputs. Bypass to ground with 0.1μF
ceramic chip capacitor.
CMLOUT(Pin 23): Negative High-Speed CML Output.
CMLOUT+ (Pin 24): Positive High-Speed CML Output.
SYNC+ (Pin 28): Sync Request Positive Input (Active
Low for Compatibility with JESD204). A low level on this
pin for at least two sample clock cycles will initiate frame
synchronization.
SYNC(Pin 29): Sync Request Negative Input. A high
level on this pin for at least two sample clock cycles will
initiate frame synchronization. For single-ended operation,
bypass to ground with a 0.1μF capacitor and use SYNC+
as the SYNC point.
FAM (Pin 31): Frame Alignment Monitor Enable. A high
level enables the substitution of predetermined data at the
end of the frame with a K28.7 symbol for frame alignment
monitoring.
PAT0 (Pin 32): Pattern Select Bit0. Use with PAT1 to select
a test pattern for the serial interface.
PAT1 (Pin 33): Pattern Select Bit1. Use with PAT0 to select
a test pattern for the serial interface.
SCRAM (Pin 34): Enable Data Scrambling. A high level on
this pin will apply the polynomial 1 + x14 + x15 in scram-
bling each ADC data sample. The scrambling takes place
before the 8B/10B encoding.
PGA (Pin 35): Programmable Gain Amplifier Control
Pin. Low selects a front-end gain of 1, input range of
2.25VP-P . High selects a front-end gain of 1.5, input range
of 1.5VP-P .
MSBINV (Pin 36): Invert the MSB. A high level will invert
the MSB to enable the 2’s complement format.
2274fb
12

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