PACKAGE DESCRIPTION
F Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1650)
1.05 p0.10
6.40 – 6.60*
(.252 – .260)
20 19 18 17 16 15 14 13 12 11
LTC2932
6.60 p0.10
4.50 p0.10
6.40
(.252)
BSC
0.45 p0.05
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50**
(.169 – .177)
0.25
REF
0o – 8o
1 2 3 4 5 6 7 8 9 10
1.10
(.0433)
MAX
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2.
DIMENSIONS
ARE
IN
MILLIMETERS
(INCHES)
0.65
(.0256)
BSC
0.19 – 0.30
(.0075 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
F20 TSSOP 0204
3. DRAWING NOT TO SCALE
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
**DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
2932fb
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