LTC4002ES8-4.2 View Datasheet(PDF) - Linear Technology
Part Name
Description
Manufacturer
LTC4002ES8-4.2 Datasheet PDF : 16 Pages
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LTC4002
PACKAGE DESCRIPTIO
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
0.675 ±0.05
R = 0.115
TYP
6
0.38 ± 0.10
10
3.50 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
3.00 ±0.10 1.65 ± 0.10
(4 SIDES) (2 SIDES)
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
PIN 1
PACKAGE TOP MARK
OUTLINE (SEE NOTE 6)
0.200 REF
0.75 ±0.05
0.00 – 0.05
(DD10) DFN 1103
5
1
0.25 ± 0.05
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.050 BSC
.045 ±.005
.189 – .197
(4.801 – 5.004)
NOTE 3
8
7
6
5
.245
MIN
.160 ±.005
.228 – .244
(5.791 – 6.197)
.150 – .157
(3.810 – 3.988)
NOTE 3
.030 ±.005
TYP
RECOMMENDED SOLDER PAD LAYOUT
1
2
.010
(0.254
–
–
.020
0.508)
×
45°
.008 – .010
(0.203 – 0.254)
0°– 8° TYP
.053 – .069
(1.346 – 1.752)
.016 – .050
(0.406 – 1.270)
NOTE:
1. DIMENSIONS
IN
INCHES
(MILLIMETERS)
.014 – .019
(0.355 – 0.483)
TYP
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
34
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
SO8 0303
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
4002f
15
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