SST29EE512-250-4C-WH View Datasheet(PDF) - Silicon Storage Technology
Part Name
Description
Manufacturer
SST29EE512-250-4C-WH Datasheet PDF : 26 Pages
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512 Kbit Page-Mode EEPROM
SST29EE512 / SST29LE512 / SST29VE512
Data Sheet
PACKAGING DIAGRAMS
Optional
Pin #1 Identifier .042
.048
TOP VIEW
.485
.495
.447
.453
2 1 32
.020 R.
MAX.
SIDE VIEW
.106
.112
.023 x 30˚
.029
.030
.040
R.
BOTTOM VIEW
.042
.048
.585 .547
.595 .553
.013
.021
.026
.400 .490
.032
BSC .530
.050
BSC.
.050
BSC.
.015 Min.
.075
.095
.026
.125
.032
.140
Note:
1. Complies with JEDEC publication 95 MS-016 AE dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in inches (min/max).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.
4. Coplanarity: 4 mils.
32.PLCC.NH-ILL.2
32-LEAD PLASTIC LEAD CHIP CARRIER (PLCC)
SST PACKAGE CODE: NH
Pin # 1 Identifier
1.05
0.95
.50
BSC
8.10
.270
.170
7.90
12.50
12.30
0.15
0.05
0.70
0.50
14.20
13.80
32.TSOP-WH-ILL.4
Note:
1. Complies with JEDEC publication 95 MO-142 BA dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (min/max).
3. Coplanarity: 0.1 (±.05) mm.
4. Maximum allowable mold flash is 0.15mm at the package ends, and 0.25mm between leads.
32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 8MM X 14MM
SST PACKAGE CODE: WH
©2001 Silicon Storage Technology, Inc.
25
S71060-06-000 6/01 301
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