M48T35PC View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
M48T35PC Datasheet PDF : 29 Pages
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M48T35 M48T35Y
4
Maximum rating
Maximum rating
Stressing the device above the rating listed in the “Absolute Maximum Ratings†table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Caution:
Caution:
Table 6. Absolute maximum ratings
Symbol
Parameter
Value
Unit
Grade 1
0 to 70
°C
TA
Ambient Operating Temperature
Grade 6
–40 to 85
°C
TSTG Storage Temperature (VCC Off, Oscillator Off)
TSLD(1)(2)(3) Lead Solder Temperature for 10 seconds
–40 to 85
°C
260
°C
VIO
Input or Output Voltages
M48T35
–0.3 to 7
V
M48T35Y
–0.3 to 7
V
VCC
Supply Voltage
M48T35
–0.3 to 7
V
M48T35Y
–0.3 to 7
V
IO
Output Current
PD
Power Dissipation
20
mA
1
W
1. For DIP package: Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to
exceed 150°C for longer than 30 seconds).
2. For SO package, standard (SnPb) lead finish: Reflow at peak temperature of 225°C (total thermal budget
not to exceed 180°C for between 90 to 150 seconds).
3. For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal
budget not to exceed 245°C for greater than 30 seconds).
Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up
mode.
Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
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