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M48T86PC1TR View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
M48T86PC1TR
ST-Microelectronics
STMicroelectronics 
M48T86PC1TR Datasheet PDF : 36 Pages
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Maximum ratings
4
Maximum ratings
M48T86
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 9. Absolute maximum ratings
Symbol
Parameter
Value
Unit
) TA
Ambient operating temperature
0 to 70
°C
t(s TSTG
Storage temperature (VCC off, oscillator off)
c TSLD(1),(2),(3) Lead solder temperature for 10 seconds
–40 to 85
°C
260
°C
du VIO
Input or output voltages
–0.3 to 7.0
V
Pro t(s) VCC
Supply voltage
–0.3 to 7.0
V
te c PD
Power dissipation
1
W
le u 1. For DIP package: soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to
d exceed 150°C for longer than 30 seconds).
so ro 2. For SOH28 package, standard (SnPb) lead finish: reflow at peak temperature of 225°C (the time above
220°C must not exceed 20 seconds).
b P 3. For SOH28 package, lead-free (Pb-free) lead finish: reflow at peak temperature of 260°C (the time above
- O te 255°C must not exceed 30 seconds).
t(s) sole Warning: Negative undershoots below –0.3 V are not allowed on any
c b pin while in the battery backup mode.
te Produ ct(s) - O Warning: Do NOT wave solder SOIC to avoid damaging SNAPHAT
OObbssoolleete Produsockets.
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