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M50FW040K5(2006) View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
M50FW040K5 Datasheet PDF : 53 Pages
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M50FW040
11 Part numbering
Part numbering
Table 27. Ordering information scheme
Example:
M50FW040
K 5 TG
Device Type
M50
Architecture
F = Firmware Hub Interface
Operating Voltage
W = 3V to 3.6V
Device Function
040 = 4 Mbit (x8), Uniform Block
Package
K = PLCC32
NB = TSOP32 (8 x 14mm)(1)
N = TSOP40: 10 x 20 mm(1)
Device Grade
5 = Temperature range –20 to 85 °C.
Device tested with standard test flow
Option
blank = Standard Packing
T = Tape & Reel Packing
Plating Technology
P or G = ECOPACK® (RoHs compliant)
1. Devices delivered in this package are Not Recommended for New Design.
Devices are shipped from the factory with the memory content bits erased to ’1’.
For a list of available options (Speed, Package, etc.) or for further information on any aspect
of this device, please contact the ST Sales Office nearest to you.
The category of second-Level Interconnect is marked on the package and on the inner box
label, in compliance with JEDEC Standard JESD97. The maximum ratings related to
soldering conditions are also marked on the inner box label.
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