M58MR016ZC-T View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
M58MR016ZC-T Datasheet PDF : 51 Pages
| |||
M58MR016C, M58MR016D
Table 35. Ordering Information Scheme
Example:
M58MR016C
Device Type
M58
Architecture
M = Multiplexed Address/Data, Dual Bank, Burst Mode
Operating Voltage
R = 1.8V
Device Function
016C = 16 Mbit (x16), Dual Bank: 1/4-3/4 partitioning, Top Boot
016D = 16 Mbit (x16), Dual Bank: 1/4-3/4 partitioning, Bottom Boot
100 ZC 6 T
Speed
100 = 100 ns
120 = 120 ns
Package
ZC = TFBGA48: 0.5 mm pitch
Temperature Range
6 = –40 to 85°C
Option
T = Tape & Reel packing
Devices are shipped from the factory with the memory content bits erased to ’1’.
Table 36. Daisy Chain Ordering Scheme
Example:
Device Type
M58MR016
Daisy Chain
-ZC = TFBGA48: 0.5 mm pitch
Option
T = Tape & Reel Packing
M58MR016
-ZC T
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de-
vice, please contact the STMicroelectronics Sales Office nearest to you.
47/51
Share Link: 