M95160-DRDW6TG View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
M95160-DRDW6TG Datasheet PDF : 47 Pages
| |||
Package mechanical data
M95160 M95160-W M95160-R M95160-DF
Figure 26. WLCSP-R–1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package outline
D
X
Y
E
aaa
(4X)
WAFER BACK SIDE
bbb Z
Detail A
A
A2
SIDE VIEW
H
F
e3
e2
e
Pin 1 corner
e1
F
G
BUMP SIDE
BUMP
eee Z
A1
Øb
Øccc M Z X Y
Øddd M Z
DETAIL A
ROTATED 90 °
Z
Seating plane
1C_ME
1. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
2. Drawing is not to scale.
3. Preliminary data.
Table 24. WLCSP-R – 1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package mechanical
data (preliminary data)
Symbol
millimeters
Typ
Min
Max
inches(1)
Typ
Min
Max
A
A1
A2
b(2)
D
E
e
e1
F
G
N (total number of
terminals)
aaa
eee
0.545
0.190
0.355
0.270
1.350
1.365
0.400
0.800
0.282
0.275
0.490
-
-
0.240
-
-
-
-
-
-
8
0.110
0.060
0.600
-
-
0.300
1.475
1.490
-
-
-
-
0.0193
0.0075
0.014
0.0106
0.0531
0.0537
0.0157
0.0315
0.0111
0.0108
0.0215
-
-
0.0094
-
-
-
-
-
-
8
0.0043
0.0024
0.0236
-
-
0.0118
0.0581
0.0587
-
-
-
-
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
44/47
DocID022580 Rev 4
Share Link: 