MC33079D View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

MC33079D

Low noise quad operational amplifier

STMicroelectronics 

Package information

4

Package information

MC33079

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

4.1

DIP14 package information

Figure 10. DIP14 package mechanical drawing

Table 4.

Ref.

a1

B

b

b1

D

E

e

e3

F

I

DIP14 package mechanical data

Dimensions

Millimeters

Min.

0.51

1.39

Typ.

0.5

0.25

8.5

2.54

15.24

Max.

1.65

20

7.1

5.1

Min.

0.020

0.055

Inches

Typ.

0.020

0.010

0.335

0.100

0.600

Max.

0.065

0.787

0.280

0.201

8/12

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