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MCP1640B-I(2015) View Datasheet(PDF) - Microchip Technology

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MCP1640B-I Datasheet PDF : 32 Pages
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MCP1640/B/C/D
5.6 Thermal Calculations
The MCP1640/B/C/D is available in two different
packages: 6-Lead SOT-23 and 8-Lead 2 x 3 DFN. The
junction temperature is estimated by calculating the
power dissipation and applying the package thermal
resistance (JA). The maximum continuous junction
temperature rating for the MCP1640/B/C/D is +125°C.
To quickly estimate the internal power dissipation for
the switching boost regulator, an empirical calculation
using measured efficiency can be used. Given the
measured efficiency, the internal power dissipation is
estimated by Equation 5-3.
EQUATION 5-3:
V----O--E---U-f--f--Ti--c---i--e--I-n--O-c---Uy-----T--
VOUT IOUT
=
PDis
The difference between the first term – input power,
and the second term – power delivered, is the internal
MCP1640/B/C/D power dissipation. This is an
estimate, assuming that most of the power lost is
internal to the MCP1640/B/C/D and not CIN, COUT and
the inductor. There is some percentage of power lost in
the boost inductor, with very little loss in the input and
output capacitors. For a more accurate estimation of
internal power dissipation, subtract the IINRMS2 x LESR
power dissipation.
5.7 PCB Layout Information
Good printed circuit board layout techniques are
important to any switching circuitry, and switching
power supplies are no different. When wiring the
switching high-current paths, short and wide traces
should be used. Therefore, it is important that the input
and output capacitors be placed as close as possible to
the MCP1640/B/C/D to minimize the loop area.
The feedback resistors and feedback signal should be
routed away from the switching node and the switching
current loop. When possible, ground planes and traces
should be used to help shield the feedback signal and
minimize noise and magnetic interference.
+VIN
L
Via to GND Plane
RBOT RTOP
+VOUT
CIN
MCP1640 COUT
1
GND
GND
Via for Enable
FIGURE 5-1:
MCP1640/B/C/D SOT-23-6 Recommended Layout.
2010-2015 Microchip Technology Inc.
DS20002234D-page 17

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