MCP3905AT-I/SS View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
MCP3905AT-I/SS Datasheet PDF : 26 Pages
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MCP3905A/05L/06A
24-Lead Plastic Shrink Small Outline (SS) (SSOP)
E
p
E1
Note:
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
B
n
D
2
1
A
c
A2
φ
A1
L
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
24
p
.026
24
0.65
Overall Height
A
.068
.073
.078
1.73
1.86
1.99
Molded Package Thickness
A2
.066
.068
.070
1.68
1.73
1.78
Standoff
A1
.002
.005
.008
0.05
0.13
0.21
Overall Width
E
.301
.307
.311
7.65
7.80
7.90
Molded Package Width
E1
.205
.209
.212
5.20
5.30
5.38
Overall Length
D
.318
.323
.328
8.07
8.20
8.33
Foot Length
L
.025
.030
.037
0.63
0.75
0.95
Lead Thickness
Foot Angle
c
.004
.006
-
0.09
0.15
-
φ
0°
4°
8°
0°
4°
8°
Lead Width
B
.010
-
.015
0.25
-
0.38
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-301
© 2006 Microchip Technology Inc.
DS22011A-page 19
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