PIC16LC621A-04I/SO View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16LC621A-04I/SO

EPROM-Based 8-Bit CMOS Microcontrollers

Microchip Technology 

PIC16C62X

12.2 DC Characteristics: PIC16C62XA-04 (Commercial, Industrial, Extended)

PIC16C62XA-20 (Commercial, Industrial, Extended)

PIC16LC62XA-04 (Commercial, Industrial, Extended) (CONT.)

PIC16C62XA

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial and

0°C ≤ TA ≤ +70°C for commercial and

-40°C ≤ TA ≤ +125°C for extended

PIC16LC62XA

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial and

0°C ≤ TA ≤ +70°C for commercial and

-40°C ≤ TA ≤ +125°C for extended

Param. Sym

No.

D010 IDD

Characteristic

Supply Current(2, 4)

D010 IDD

Supply Current(2)

D020

IPD

Power-down Current(3)

D020

IPD

Power-down Current(3)

Min Typ† Max Units

Conditions

— 1.2 2.0 mA FOSC = 4 MHz, VDD = 5.5V, WDT disabled,

XT mode, (Note 4)*

— 0.4 1.2 mA FOSC = 4 MHz, VDD = 3.0V, WDT disabled,

XT mode, (Note 4)*

— 1.0 2.0 mA FOSC = 10 MHz, VDD = 3.0V, WDT dis-

abled, HS mode, (Note 6)

— 4.0 6.0 mA FOSC = 20 MHz, VDD = 4.5V, WDT dis-

abled, HS mode

— 4.0 7.0 mA FOSC = 20 MHz, VDD = 5.5V, WDT dis-

abled*, HS mode

— 35 70 µA FOSC = 32 kHz, VDD = 3.0V, WDT dis-

abled, LP mode

— 1.2 2.0 mA FOSC = 4 MHz, VDD = 5.5V, WDT disabled,

XT mode, (Note 4)*

— — 1.1 mA FOSC = 4 MHz, VDD = 2.5V, WDT disabled,

XT mode, (Note 4)

— 35 70 µA FOSC = 32 kHz, VDD = 2.5V, WDT dis-

abled, LP mode

—

—

2.2

µA VDD = 3.0V

—

—

5.0

µA VDD = 4.5V*

—

—

9.0

µA VDD = 5.5V

—

—

15

µA VDD = 5.5V Extended Temp.

—

—

2.0

µA VDD = 2.5V

—

—

2.2

µA VDD = 3.0V*

—

—

9.0

µA VDD = 5.5V

—

—

15

µA VDD = 5.5V Extended Temp.

*

†

Note 1:

2:

3:

4:

5:

6:

These parameters are characterized but not tested.

Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not

tested.

This is the limit to which VDD can be lowered without losing RAM data.

The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and

switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current

consumption.

The test conditions for all IDD measurements in Active Operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD,

MCLR = VDD; WDT enabled/disabled as specified.

The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with

the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.

For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the

formula: Ir = VDD/2REXT (mA) with REXT in kΩ.

The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the

base IDD or IPD measurement.

Commercial temperature range only.

 2003 Microchip Technology Inc.

DS30235J-page 91

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