ST72521M/R/AR
12.7 EMC CHARACTERISTICS
Susceptibility tests are performed on a sample ba-
sis during product characterization.
12.7.1 Functional EMS
(Electro Magnetic Susceptibility)
Based on a simple running application on the
product (toggling 2 LEDs through I/O ports), the
product is stressed by two electro magnetic events
until a failure occurs (indicated by the LEDs).
s ESD: Electro-Static Discharge (positive and
negative) is applied on all pins of the device until
a functional disturbance occurs. This test
conforms with the IEC 1000-4-2 standard.
s FTB: A Burst of Fast Transient voltage (positive
and negative) is applied to VDD and VSS through
a 100pF capacitor, until a functional disturbance
occurs. This test conforms with the IEC 1000-4-
4 standard.
A device reset allows normal operations to be re-
sumed.
Symbol
VFESD
VFFTB
Parameter
Conditions
Voltage limits to be applied on any I/O pin VDD=5V, TA=+25°C, fOSC=8MHz
to induce a functional disturbance
conforms to IEC 1000-4-2
Fast transient voltage burst limits to be ap-
plied through 100pF on VDD and VDD pins
to induce a functional disturbance
VDD=5V, TA=+25°C, fOSC=8MHz
conforms to IEC 1000-4-4
Neg 1) Pos 1)
-1
1.5
-1.5 1.5
Unit
kV
12.7.2 Electro Magnetic Interference (EMI)
Based on a simple application running on the product (toggling 2 LEDs through the I/O ports), the product
is monitored in terms of emission. This emission test is in line with the norm SAE J 1752/3 which specifies
the board and the loading of each pin.
Symbol
Parameter
SEMI Peak level
Conditions
Monitored
Frequency Band
0.1MHz to 30MHz
VDD=5V, TA=+25°C,
30MHz to 130MHz
TQFP64 14x14 package
conforming to SAE J 1752/3 130MHz to 1GHz
SAE EMI Level
Max vs. [fOSC/fCPU]
8/4MHz 16/8MHz
13
13
19
24
7
13
2.0
2.5
Unit
dBµV
-
Notes:
1. Data based on characterization results, not tested in production.
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