ST7LITES2 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

ST7LITES2

8-BIT MICROCONTROLLER WITH SINGLE VOLTAGE FLASH MEMORY, DATA EEPROM, ADC, TIMERS, SPI

STMicroelectronics 

ST7LITE0x, ST7LITESx

14.3 SOLDERING INFORMATION

In accordance with the RoHS European directive,

all STMicroelectronics packages will be converted

in 2005 to lead-free technology, named ECO-

PACKTM (for a detailed roadmap, please refer to

PCN CRP/04/744 "Lead-free Conversion Program

- Compliance with RoHS", issued November 18th,

2004).

■ ECOPACKTM packages are qualified according

to the JEDEC STD-020C compliant soldering

profile.

■ Detailed information on the STMicroelectronics

ECOPACKTM transition program is available on

www.st.com/stonline/leadfree/, with specific

technical Application notes covering the main

technical aspects related to lead-free

conversion (AN2033, AN2034, AN2035,

AN2036).

Backward and forward compatibility:

The main difference between Pb and Pb-free sol-

dering process is the temperature range.

– ECOPACKTM TQFP, SDIP and SO packages

are fully compatible with Lead (Pb) containing

soldering process (see application note AN2034)

– TQFP, SDIP and SO Pb-packages are compati-

ble with Lead-free soldering process, neverthe-

less it's the customer's duty to verify that the Pb-

packages maximum temperature (mentioned on

the Inner box label) is compatible with their Lead-

free soldering temperature.

Table 20. Soldering Compatibility (wave and reflow soldering process)

Package

Plating material devices

Pb solder paste

Pb-free solder paste

SDIP & PDIP

Sn (pure Tin)

Yes

Yes *

QFN

Sn (pure Tin)

Yes

Yes *

TQFP and SO

NiPdAu (Nickel-palladium-Gold)

Yes

Yes *

* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)

is compatible with their Lead-free soldering process.

113/125

Share Link: