PIC10F200-E_MC View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC10F200-E_MC

6-Pin, 8-bit Flash Microcontrollers

Microchip Technology 

PIC10F200/202/204/206

8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

e

b

N

L

NOTE 1

12

TOP VIEW

K

E

EXPOSED PAD

E2

21

D2

BOTTOM VIEW

NOTE 1

A

A3

A1

NOTE 2

Units

MILLIMETERS

Dimension Limits

MIN

NOM

Number of Pins

N

8

Pitch

e

0.50 BSC

Overall Height

A

0.80

0.90

Standoff

A1

0.00

0.02

Contact Thickness

A3

0.20 REF

Overall Length

D

2.00 BSC

Overall Width

E

3.00 BSC

Exposed Pad Length

D2

1.30

–

Exposed Pad Width

E2

1.50

–

Contact Width

b

0.18

0.25

Contact Length

L

0.30

0.40

Notes:

Contact-to-Exposed Pad

K

0.20

–

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. Package is saw singulated.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

MAX

1.00

0.05

1.75

1.90

0.30

0.50

–

Microchip Technology Drawing C04-123B

© 2007 Microchip Technology Inc.

DS41239D-page 85

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