PIC10F220T-E/P View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC10F220T-E/P

High-Performance Microcontrollers with 8-bit A/D

Microchip Technology 

PIC10F220/222

8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

e

b

N

L

NOTE 1

12

TOP VIEW

K

E

EXPOSED PAD

E2

21

D2

BOTTOM VIEW

NOTE 1

A

A3

A1

NOTE 2

Units

Dimension Limits

MILLIMETERS

MIN

NOM

MAX

Number of Pins

Pitch

Overall Height

N

8

e

0.50 BSC

A

0.80

0.90

1.00

Standoff

Contact Thickness

Overall Length

Overall Width

A1

0.00

0.02

0.05

A3

0.20 REF

D

2.00 BSC

E

3.00 BSC

Exposed Pad Length

Exposed Pad Width

Contact Width

D2

1.30

–

1.75

E2

1.50

–

1.90

b

0.18

0.25

0.30

Contact Length

L

0.30

0.40

0.50

Notes:

Contact-to-Exposed Pad

K

0.20

–

–

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. Package is saw singulated.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-123B

© 2007 Microchip Technology Inc.

DS41270E-page 77

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