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PIC12F629-I View Datasheet(PDF) - Microchip Technology

Part Name
Description
Manufacturer
PIC12F629-I
Microchip
Microchip Technology 
PIC12F629-I Datasheet PDF : 132 Pages
First Prev 121 122 123 124 125 126 127 128 129 130 Next Last
PIC12F629/675
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S)
Land Pattern and Solder Mask
M
SOLDER
MASK
M
p
B
PACKAGE
EDGE
L
Pitch
Pad Width
Pad Length
Pad to Solder Mask
*Controlling Parameter
Units
Dimension Limits
p
B
L
M
Drawing No. C04-2113
MIN
.014
.020
.005
INCHES
NOM
.050 BSC
.016
.024
MAX
.019
.030
.006
MILLIMETERS*
MIN
NOM
1.27 BSC
0.35
0.40
0.50
0.60
0.13
MAX
0.47
0.75
0.15
2003 Microchip Technology Inc.
DS41190C-page 119

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