PIC12F609T-I/P View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC12F609T-I/P Datasheet PDF : 212 Pages
| |||
PIC12F609/615/617/12HV609/615
18.0 PACKAGING INFORMATION
18.1 Package Marking Information
8-Lead PDIP (.300”)
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (.150”)
XXXXXXXX
XXXXYYWW
NNN
8-Lead MSOP
XXXXXX
YWWNNN
Example
XXFXXX/P
017 e3
0610
Example
PICXXCXX
/SN0610 e3
017
Example
602/MS
610017
8-Lead DFN (3x3 mm)
XXXX
YYWW
NNN
Example
XXXX
0610
017
8-Lead DFN (4x4 mm) (for PIC12F609/615/HV609/615
devices only)
XXXXXX
XXXXXX
YYWW
NNN
Example
XXXXXX
XXXX e3
0610
017
Legend: XX...X Customer-specific information
Y
Year code (last digit of calendar year)
YY
Year code (last 2 digits of calendar year)
WW
Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
e3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator ( ) e3
can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will be
carried over to the next line, thus limiting the number of available characters for
customer-specific information.
* Standard PIC device marking consists of Microchip part number, year code, week code, and traceability code. For
PIC device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP
devices, any special marking adders are included in QTP price.
2010 Microchip Technology Inc.
DS41302D-page 195
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