PIC12F609T-I/P View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC12F609T-I/P

8-Pin Flash-Based, 8-Bit CMOS Microcontrollers

Microchip Technology 

PIC12F609/615/617/12HV609/615

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.

X

/XX

Device

Temperature Package

Range

XXX

Pattern

Device:

Temperature

Range:

Package:

Pattern:

PIC12F609, PIC12F609T(1), PIC12HV609, PIC12HV609T(1),

PIC12F615, PIC12F615T(1), PIC12HV615, PIC12HV615T(1),

PIC12F617, PIC12F617T(1)

H

= -40C to +150C (High Temp)(3)

I

= -40C to +85C (Industrial)

E

= -40C to +125C (Extended)

P

=

SN =

MS =

MF =

MD =

Plastic DIP (PDIP)

8-lead Small Outline (150 mil) (SOIC)

Micro Small Outline (MSOP)

8-lead Plastic Dual Flat, No Lead (3x3) (DFN)

8-lead Plastic Dual Flat, No Lead

(4x4)(DFN)(1,2)

QTP, SQTP or ROM Code; Special Requirements

(blank otherwise)

Examples:

a) PIC12F615-E/P 301 = Extended Temp., PDIP

package, 20 MHz, QTP pattern #301

b) PIC12F615-I/SN = Industrial Temp., SOIC

package, 20 MHz

c) PIC12F615T-E/MF = Tape and Reel, Extended

Temp., 3x3 DFN, 20 MHz

d) PIC12F609T-E/MF = Tape and Reel, Extended

Temp., 3x3 DFN, 20 MHz

e) PIC12HV615T-E/MF = Tape and Reel,

Extended Temp., 3x3 DFN, 20 MHz

f) PIC12HV609T-E/MF = Tape and Reel,

Extended Temp., 3x3 DFN, 20 MHz

g) PIC12F617T-E/MF = Tape and Reel, Extended

Temp., 3x3 DFN, 20 MHz

h) PIC12F617-I/P = Industrial Temp., PDIP pack-

age, 20 MHz

i) PIC12F615-H/SN = High Temp., SOIC pack-

age, 20 MHz

Note 1:

2:

3:

T = in tape and reel for MSOP, SOIC and

DFN packages only.

Not available for PIC12F617.

High Temp. available for PIC12F615 only.

 2010 Microchip Technology Inc.

DS41302D-page 211

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