PIC16C56T-10/SP View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16C56T-10/SP Datasheet PDF : 192 Pages
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PIC16C5X
18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
W2
D
2
n
1
W1
E
A
A2
c
A1
eB
B1
B
L
p
Units
Dimension Limits
Number of Pins
n
Pitch
p
Top to Seating Plane
A
Ceramic Package Height
A2
Standoff
A1
Shoulder to Shoulder Width
E
Ceramic Pkg. Width
E1
Overall Length
D
Tip to Seating Plane
L
Lead Thickness
c
Upper Lead Width
B1
Lower Lead Width
B
Overall Row Spacing
§
eB
Window Width
W1
Window Length
W2
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-036
Drawing No. C04-010
MIN
.170
.155
.015
.300
.285
.880
.125
.008
.050
.016
.345
.130
.190
INCHES*
NOM
18
.100
.183
.160
.023
.313
.290
.900
.138
.010
.055
.019
.385
.140
.200
MAX
.195
.165
.030
.325
.295
.920
.150
.012
.060
.021
.425
.150
.210
MILLIMETERS
MIN
NOM
18
2.54
4.32
4.64
3.94
4.06
0.38
0.57
7.62
7.94
7.24
7.37
22.35
22.86
3.18
3.49
0.20
0.25
1.27
1.40
0.41
0.47
8.76
9.78
3.30
3.56
4.83
5.08
MAX
4.95
4.19
0.76
8.26
7.49
23.37
3.81
0.30
1.52
0.53
10.80
3.81
5.33
DS30453E-page 180
Preliminary
1997-2013 Microchip Technology Inc.
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