PIC16C65T-20/SS View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16C65T-20/SS Datasheet PDF : 336 Pages
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PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
18.1 DC Characteristics: PIC16C62/64-04 (Commercial, Industrial)
PIC16C62/64-10 (Commercial, Industrial)
PIC16C62/64-20 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40˚C ≤ TA ≤ +85˚C for industrial and
0˚C ≤ TA ≤ +70˚C for commercial
Param
No.
Characteristic
Sym Min Typ† Max Units
Conditions
D001
D001A
Supply Voltage
VDD 4.0 - 6.0 V XT, RC and LP osc configuration
4.5 - 5.5 V HS osc configuration
D002*
RAM Data Retention VDR
Voltage (Note 1)
- 1.5 - V
D003
VDD start voltage to VPOR
ensure internal Power-
on Reset signal
- VSS -
V See section on Power-on Reset for details
D004*
VDD rise rate to ensure SVDD 0.05 -
internal Power-on
Reset signal
- V/ms See section on Power-on Reset for details
D010
Supply Current
(Note 2, 5)
IDD
- 2.7 5.0 mA XT, RC, osc configuration
FOSC = 4 MHz, VDD = 5.5V (Note 4)
D013
- 13.5 30 mA HS osc configuration
FOSC = 20 MHz, VDD = 5.5V
D020
D021
D021A
Power-down Current IPD
(Note 3, 5)
- 10.5 42 µA VDD = 4.0V, WDT enabled, -40°C to +85°C
- 1.5 21 µA VDD = 4.0V, WDT disabled, -0°C to +70°C
- 1.5 24 µA VDD = 4.0V, WDT disabled, -40°C to +85°C
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 µA to the specification. This value is from charac-
terization and is for design guidance only. This is not tested.
DS30234D-page 184
© 1997 Microchip Technology Inc.
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