PIC16LCR65T-04/JW View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16LCR65T-04/JW

8-Bit CMOS Microcontrollers

Microchip Technology 

PIC16C6X

20.2

Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67

DC Characteristics: PIC16LC65-04 (Commercial, Industrial)

DC CHARACTERISTICS

Param

No.

Characteristic

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40˚C ≤ TA ≤ +85˚C for industrial and

0˚C ≤ TA ≤ +70˚C for commercial

Sym Min Typ† Max Units

Conditions

D001 Supply Voltage

VDD 3.0 - 6.0 V LP, XT, RC osc configuration (DC - 4 MHz)

D002* RAM Data Retention

Voltage (Note 1)

VDR

- 1.5 - V

D003 VDD start voltage to

VPOR - VSS -

ensure internal Power-on

Reset signal

V See section on Power-on Reset for details

D004* VDD rise rate to ensure SVDD 0.05 -

internal Power-on Reset

signal

- V/ms See section on Power-on Reset for details

D010 Supply Current (Note 2, 5) IDD

- 2.0 3.8 mA XT, RC osc configuration

FOSC = 4 MHz, VDD = 3.0V (Note 4)

D010A

- 22.5 105 µA LP osc configuration

FOSC = 32 kHz, VDD = 4.0V, WDT disabled

D020 Power-down Current

IPD

- 7.5 800 µA VDD = 3.0V, WDT enabled, -40°C to +85°C

D021 (Note 3, 5)

- 0.9 800 µA VDD = 3.0V, WDT disabled, 0°C to +70°C

D021A

- 0.9 800 µA VDD = 3.0V, WDT disabled, -40°C to +85°C

* These parameters are characterized but not tested.

† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: This is the limit to which VDD can be lowered without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,

MCLR = VDD; WDT enabled/disabled as specified.

3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-

mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.

5: Timer1 oscillator (when enabled) adds approximately 20 µA to the specification. This value is from character-

ization and is for design guidance only. This is not tested.

© 1997 Microchip Technology Inc.

DS30234D-page 217

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