PIC16CR67-20E/SO View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16CR67-20E/SO Datasheet PDF : 336 Pages
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PIC16C6X
25.14 Package Marking Information
18-Lead PDIP
MMMMMMMMMMMMM
XXXXXXXXXXXXXXXX
AABBCDE
18-Lead SOIC
MMMMMMMMMM
XXXXXXXXXXXX
XXXXXXXXXXXX
AABBCDE
18-Lead CERDIP Windowed
MMMMMM
XXXXXXXX
AABBCDE
28-Lead PDIP (.300 MIL)
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
AABBCAE
Example
PIC16C61-04/P
9450CBA
Example
PIC16C61
-20/SO
9449CBA
Example
PIC16C61
/JW
9440CBT
Example
PIC16C63-04I/SP
9452CAN
Legend:
MM...M
XX...X
AA
BB
C
D1
D2
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
S = Tempe, Arizona, U.S.A.
Mask revision number for microcontroller
Mask revision number for EEPROM
Assembly code of the plant or country of origin in which
part was assembled.
Note:
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
DS30234D-page 304
© 1997 Microchip Technology Inc.
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