PIC16LCR65T-10 View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16LCR65T-10 Datasheet PDF : 336 Pages
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Package Marking Information (Cont’d)
28-Lead SOIC
MMMMMMMMMMMMMMMMMMXX
XXXXXXXXXXXXXXXXXXXX
AABBCAE
PIC16C6X
Example
PIC16C62-20/S0111
9515SBA
28-Lead CERDIP Skinny Windowed
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
AABBCDE
Example
PIC16C62/JW
9517SBT
28-Lead Side Brazed Skinny Windowed
XXXXXXXXXXX
XXXXXXXXXXX
AABBCDE
Example
PIC16C66/JW
9517CAT
28-Lead SSOP
XXXXXXXXXXXX
XXXXXXXXXXXX
AABBCAE
40-Lead PDIP
MMMMMMMMMMMMMM
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXX
AABBCDE
Example
PIC16C62
20I/SS025
9517SBP
Example
PIC16C65-04/P
9510CAA
Legend:
MM...M
XX...X
AA
BB
C
D1
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
S = Tempe, Arizona, U.S.A.
Mask revision number for microcontroller
Assembly code of the plant or country of origin in which
part was assembled.
Note:
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
© 1997 Microchip Technology Inc.
DS30234D-page 305
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