PIC16CR67-10I/SO View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16CR67-10I/SO Datasheet PDF : 336 Pages
| |||
PIC16C6X
Package Marking Information (Cont’d)
40-Lead CERDIP Windowed
MMMMMMMMM
XXXXXXXXXXX
XXXXXXXXXXX
AABBCDE
44-Lead PLCC
MMMMMMMM
XXXXXXXXXX
XXXXXXXXXX
AABBCDE
44-Lead MQFP
MMMMMMMM
XXXXXXXXXX
XXXXXXXXXX
AABBCDE
Example
Example
PIC16C67/JW
9450CAT
PIC16C64
-20/L
9442CAN
Example
PIC16C64
-04/PQ
9444CAP
44-Lead TQFP
MMMMMMMM
XXXXXXXXXX
XXXXXXXXXX
AABBCDE
Example
PIC16C64A
-10/TQ
AABBCDE
Legend:
MM...M
XX...X
AA
BB
C
D1
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
S = Tempe, Arizona, U.S.A.
Mask revision number for microcontroller
Assembly code of the plant or country of origin in which
part was assembled.
Note:
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
DS30234D-page 306
© 1997 Microchip Technology Inc.
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