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UPD78F0134M1GBA-8EU View Datasheet(PDF) - NEC => Renesas Technology

Part Name
Description
Manufacturer
UPD78F0134M1GBA-8EU
NEC
NEC => Renesas Technology 
UPD78F0134M1GBA-8EU Datasheet PDF : 415 Pages
First Prev 41 42 43 44 45 46 47 48 49 50 Next Last
CHAPTER 1 GENERAL
Table 1-5. Functional Outline of µPD78078 Subseries
Part Number
Item
µPD78076
µPD78078
µPD78P078
Internal ROM
memory
Mask ROM
48K bytes
60K bytes
PROM
60K bytesNote 1
High-speed RAM 1024 bytes
Buffer RAM
32 bytes
Expansion RAM 1024 bytes
Memory space
64K bytes
General-purpose register 8 bits × 8 × 4 banks
Minimum With main
0.4 µs/0.8 µs/1.6 µs/3.2 µs/6.4 µs/12.8 µs (at 5.0 MHz)
instruction system clock
execution With subsystem 122 µs (at 32.768 kHz)
timon
clock
Instruction set
• 16-bit operation
• Multiplication/division (8 bits × 8 bits, 16 bits ÷ 8 bits)
• Bit manipulation (set, reset, test, Boolean operation)
• BCD adjustment, etc.
I/O port
• Total
: 88
• CMOS input
:2
• CMOS I/O
: 78
• N-ch open-drain I/O : 8
A/D converter
8-bit resolution × 8 channels
D/A converter
8-bit resolution × 2 channels
Serial interface
• 3-wire serial I/O/SBI/2-wire serial I/O mode selectable
: 1 channel
• 3-wire serial I/O mode (with function to automatically transfer/receive up to 32 bytes) : 1 channel
• 3-wire serial I/O/UART mode selectable
: 1 channel
Timer
• 16-bit timer/event counter : 1 channel
• 8-bit timer/event counter : 4 channels
• Watch timer
: 1 channel
• Watchdog timer
: 1 channel
Timer output
5 (14-bit PWM output: 1, 8-bit PWM output: 2)
Clock output
19.5 kHz, 39.1 kHz, 78.1 kHz, 156 kHz, 313 kHz, 625 kHz, 1.25 MHz, 2.5 MHz, 5.0 MHz (with
main system clock of 5.0 MHz), 32.768 kHz (with subsystem clock of 32.768 kHz)
Vectored Maskable
Internal: 15, external: 7
interrupt Non-maskable Internal: 1
source Software
1
Test input
Internal: 1, external: 1
Supply voltage
VDD = 1.8 to 5.5 V
Package
• 100-pin plastic QFP (fine pitch) (14 × 14 mm, resin thickness 1.45 mm)
• 100-pin plastic LQFP (fine pitch) (14 × 14 mm, resin thickness 1.4 mm)Note 2
• 100-pin plastic QFP (14 × 20 mm, resin thickness 2.7 mm)
• 100-pin ceramic WQFN (14 × 20 mm) (µPD78P078 only)
Notes 1. The internal ROM capacity can be changed by using a memory size select register (IMS).
2. Under planning
15

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