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PIC16LC8X View Datasheet(PDF) - Microchip Technology

Part Name
Description
Manufacturer
PIC16LC8X
Microchip
Microchip Technology 
PIC16LC8X Datasheet PDF : 117 Pages
First Prev 111 112 113 114 115 116 117
15.3 Package Marking Information
18L PDIP
MMMMMMMMMMMMXXX
MMMMMMMMXXXXXXXX
AABB CDE
PIC16C8X
Example
PIC16C84
10I/P
9305 CBA
18L SOIC
XXXXXXXX
XXXXXXXX
AABB CDE
Example
PIC16LC84
04I/S0218
9310 CBA
Legend: MM...M
XX...X
AA
BB
C
D
E
Microchip part number information
Customer specific information*
Year code (last two digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
C = Chandler, Arizona, U.S.A.,
S = Tempe, Arizona, U.S.A.
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line,
it will be carried over to the next line thus limiting the number of available
characters for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week
code, facility code, mask rev#, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
© 1995 Microchip Technology Inc.
DS30081F-page 111

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