PIC16C8X
Applicable Devices 83 R83 84 84A R84
13.2 DC CHARACTERISTICS: PIC16LC84A, PIC16LC83 (Commercial, Industrial)
PIC16LCR84, PIC16LCR83 (Commercial, Industrial)
DC CHARACTERISTICS
Parameter Sym
No.
Characteristic
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C ≤ TA ≤ +85°C for industrial and
0°C ≤ TA ≤ +70°C for commercial
Min Typ† Max Units
Conditions
D001
VDD Supply Voltage
2.0 — 6.0 V XT, RC, and LP osc configuration
D002
VDR RAM Data Retention 1.5 * — —
Voltage (Note 1)
V Device in SLEEP mode
D003
VPOR VDD start voltage to
ensure
Power-on Reset
— VSS — V See section on Power-on Reset for details
D004
SVDD VDD rise rate to
ensure
Power-on Reset
0.05* — — V/ms See section on Power-on Reset for details
D010
D010A
IDD Supply Current
(Note 2)
D014
RC and XT osc configuration (Note 4)
— 1.8 4.5 mA
FOSC = 2.0 MHz, VDD = 5.5V
— 7.3 10 mA
FOSC = 2.0 MHz, VDD = 5.5V
(During EEPROM programming)
LP osc configuration
— 15 32 µA
FOSC = 32 kHz, VDD = 2.0V,
WDT disabled
D020
D021
D021A
IPD Power-down Current — 3.0 16 µA VDD = 2.0V, WDT enabled, -40°C to +85°C
(Note 3)
— 0.4 7.0 µA VDD = 2.0V, WDT disabled, 0°C to +70°C
— 0.4 9.0 µA VDD = 2.0V, WDT disabled, -40°C to +85°C
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1=external square wave, from rail to rail; all I/O pins tristated, pulled to VDD, T0CKI = VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be
estimated by the formula IR = VDD/2Rext (mA) with Rext in kOhm.
DS30081F-page 98
Preliminary
© 1995 Microchip Technology Inc.