PIC16CE624T-04SS View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16CE624T-04SS Datasheet PDF : 113 Pages
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14.1 Package Marking Information
18-Lead PDIP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
AABBCDE
18-Lead SOIC (.300")
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
AABBCDE
18-Lead CERDIP Windowed
XXXXXXXX
XXXXXXXX
AABBCDE
20-Lead SSOP
XXXXXXXXXX
XXXXXXXXXX
AABBCDE
PIC16CE62X
Example
PIC16CE625
-04I/P423
9907CDK
Example
PIC16CE625
-04I/SO218
9907CDK
Example
16CE625
/JW
9907CBA
Example
PIC16CE625
-04I/218
9907CBP
Legend: MM...M
XX...X
AA
BB
C
D
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
© 1999 Microchip Technology Inc.
DS40182C-page 101
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