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PIC16F616T-I/SL View Datasheet(PDF) - Microchip Technology

Part Name
Description
Manufacturer
PIC16F616T-I/SL
Microchip
Microchip Technology 
PIC16F616T-I/SL Datasheet PDF : 214 Pages
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PIC16F610/616/16HV610/616
15.10 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No.
Sym
Characteristic
Typ
Units
Conditions
TH01
TH02
TH03
TH04
TH05
TH06
TH07
*
Note 1:
2:
θJA
Thermal Resistance
Junction to Ambient
70*
85.0*
C/W 14-pin PDIP package
C/W 14-pin SOIC package
100*
C/W 14-pin TSSOP package
37*
C/W 16-pin QFN 4x4mm package
θJC
Thermal Resistance
Junction to Case
32.5*
31.0*
C/W 14-pin PDIP package
C/W 14-pin SOIC package
31.7*
C/W 14-pin TSSOP package
2.6*
C/W 16-pin QFN 4x4mm package
TDIE
Die Temperature
150*
C
PD
Power Dissipation
W PD = PINTERNAL + PI/O
PINTERNAL Internal Power Dissipation
W PINTERNAL = IDD x VDD
(NOTE 1)
PI/O
I/O Power Dissipation
W PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))
PDER
Derated Power
W PDER = PDMAX (TDIE - TA)/θJA
(NOTE 2)
These parameters are characterized but not tested.
IDD is current to run the chip alone without driving any load on the output pins.
TA = Ambient Temperature.
© 2009 Microchip Technology Inc.
DS41288F-page 155

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