PIC16F631T-E/SO View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16F631T-E/SO

20-Pin Flash-Based, 8-Bit CMOS Microcontrollers with nanoWatt Technology

Microchip Technology 

PIC16F631/677/685/687/689/690

17.5 Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +125°C

Param

No.

TH01

TH02

TH03

TH04

TH05

TH06

TH07

Note 1:

2:

3:

Sym.

Characteristic

Typ.

Units

Conditions

θJA

Thermal Resistance

Junction to Ambient

62.4

C/W 20-pin PDIP package

85.2

C/W 20-pin SOIC package

108.1 C/W 20-pin SSOP package

40

C/W 20-pin QFN 4x4mm package

θJC

Thermal Resistance

Junction to Case

28.1

C/W 20-pin PDIP package

24.2

C/W 20-pin SOIC package

32.2

C/W 20-pin SSOP package

2.5

C/W 20-pin QFN 4x4mm package

TDIE

Die Temperature

150

C For derated power calculations

PD

Power Dissipation

—

W PD = PINTERNAL + PI/O

PINTERNAL Internal Power Dissipation

—

W PINTERNAL = IDD x VDD

(NOTE 1)

PI/O

I/O Power Dissipation

—

W PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))

PDER

Derated Power

—

W PDER = PDMAX (TDIE - TA)/θJA

(NOTE 2, 3)

IDD is current to run the chip alone without driving any load on the output pins.

TA = Ambient Temperature.

Maximum allowable power dissipation is the lower value of either the absolute maximum total power

dissipation or derated power.

© 2008 Microchip Technology Inc.

DS41262E-page 239

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