PIC16F76T-I/SP View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16F76T-I/SP Datasheet PDF : 174 Pages
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PIC16F7X
28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF)
E
EXPOSED
METAL
E1
PADS
CH x 45
TOP VIEW
α
D1 D
2
1
n
D2
R
E2
BOTTOM VIEW
Q
p
B
L
A2
A
A1
A3
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
28
p
.026 BSC
28
0.65 BSC
Overall Height
A
.033
.039
0.85
1.00
Molded Package Thickness
A2
.026
.031
0.65
0.80
Standoff
A1
.000
.0004
.002
0.00
0.01
0.05
Base Thickness
A3
.008 REF.
0.20 REF.
Overall Width
E
.236 BSC
6.00 BSC
Molded Package Width
E1
.226 BSC
5.75 BSC
Exposed Pad Width
E2
.140
.146
.152
3.55
3.70
3.85
Overall Length
D
.236 BSC
6.00 BSC
Molded Package Length
D1
.226 BSC
5.75 BSC
Exposed Pad Length
D2
.140
.146
.152
3.55
3.70
3.85
Lead Width
B
.009
.011
.014
0.23
0.28
0.35
Lead Length
L
.020
.024
.030
0.50
0.60
0.75
Tie Bar Width
R
.005
.007
.010
0.13
0.17
0.23
Tie Bar Length
Q
.012
.016
.026
0.30
0.40
0.65
Chamfer
CH
.009
.017
.024
0.24
0.42
0.60
Mold Draft Angle Top
α
12
12
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-114
DS30325B-page 156
2002 Microchip Technology Inc.
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