PIC16F721-IP View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16F721-IP

20-Pin Flash Microcontrollers

Microchip Technology 

PIC16(L)F720/721

23.5 Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature-40°C  TA  +125°C

Param.

No.

Sym.

Characteristic

Typ.

Units

Conditions

TH01

JA Thermal Resistance Junction to

Ambient

62.2

C/W 20-pin PDIP package

75.0

C/W 20-pin SOIC package

89.3

C/W 20-pin SSOP package

43.0

C/W 20-pin QFN 4x4mm package

TH02

JC Thermal Resistance Junction to

Case

27.5

C/W 20-pin PDIP package

23.1

C/W 20-pin SOIC package

31.1

C/W 20-pin SSOP package

5.3

C/W 20-pin QFN 4x4mm package

TH03

TJMAX Maximum Junction Temperature

150

C

TH04

PD Power Dissipation

TH05 PINTERNAL Internal Power Dissipation

—

W PD = PINTERNAL + PI/O

—

W

PINTERNAL = IDD x VDD(1)

TH06

TH07

PI/O I/O Power Dissipation

PDER Derated Power

—

W PI/O =  (IOL * VOL) +  (IOH * (VDD -

VOH))

—

W

PDER = PDMAX (TJ - TA)/JA(2)

Note 1: IDD is current to run the chip alone without driving any load on the output pins.

2: TA = Ambient Temperature; TJ = Junction Temperature

DS41430D-page 192

 2010-2013 Microchip Technology Inc.

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