PIC16F726-I/SP View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16F726-I/SP

28/40/44-Pin Flash Microcontrollers with nanoWatt XLP Technology

Microchip Technology 

PIC16F72X/PIC16LF72X

TABLE 23-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER,

AND BROWN-OUT RESET PARAMETERS

Standard Operating Conditions (unless otherwise stated)

Operating Temperature -40°C ≤ TA ≤ +125°C

Param

No.

Sym.

Characteristic

Min. Typ† Max. Units

Conditions

30 TMCL MCLR Pulse Width (low)

2

— — μs VDD = 3.3-5V, -40°C to +85°C

5

— — μs VDD = 3.3-5V

31 TWDTLP Low Power Watchdog Timer Time- 10 18 27 ms VDD = 3.3V-5V

out Period (No Prescaler)

32

TOST Oscillator Start-up Timer Period(1),

— 1024 — Tosc (Note 3)

(2)

33* TPWRT Power-up Timer Period, PWRTE = 0 40 65 140 ms

34* TIOZ

I/O high-impedance from MCLR Low —

or Watchdog Timer Reset

— 2.0 μs

35 VBOR Brown-out Reset Voltage

2.38 2.5 2.73

1.80 1.9 2.11

V BORV=2.5V

BORV=1.9V

36* VHYST Brown-out Reset Hysteresis

0 25 50 mV -40°C to +85°C

37* TBORDC Brown-out Reset DC Response

Time

1

3

5

μs VDD ≤ VBOR, -40°C to +85°C

10

VDD ≤ VBOR

* These parameters are characterized but not tested.

† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance

only and are not tested.

Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are

based on characterization data for that particular oscillator type under standard operating conditions with the

device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or

higher than expected current consumption. All devices are tested to operate at “min” values with an external

clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no

clock) for all devices.

2: By design.

3: Period of the slower clock.

4: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as

possible. 0.1 μF and 0.01 μF values in parallel are recommended.

DS41341E-page 228

© 2009 Microchip Technology Inc.

Share Link: