PIC16C715-10E/SP View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16C715-10E/SP Datasheet PDF : 176 Pages
| |||
17.5 Package Marking Information
18-Lead PDIP
MMMMMMMMMMMMM
XXXXXXXXXXXXXXXX
AABBCDE
18-Lead SOIC
MMMMMMMMMM
XXXXXXXXXXXX
XXXXXXXXXXXX
AABBCDE
18-Lead CERDIP Windowed
MMMMMM
XXXXXXXX
AABBCDE
20-Lead SSOP
XXXXXXXX
XXXXXXXX
AABBCAE
PIC16C71X
Example
PIC16C711-04/P
9452CBA
Example
PIC16C715
-20/50
9447CBA
Example
PIC16C71
/JW
945/CBT
Example
PIC16C710
20I/SS025
9517SBP
Legend:
MM...M
XX...X
AA
BB
C
D1
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
S = Tempe, Arizona, U.S.A.
Mask revision number for microcontroller
Assembly code of the plant or country of origin in which
part was assembled.
Note:
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
© 1997 Microchip Technology Inc.
DS30272A-page 159
Share Link: 