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PIC18LF45J10-I/SP View Datasheet(PDF) - Microchip Technology

Part Name
Description
Manufacturer
PIC18LF45J10-I/SP Datasheet PDF : 358 Pages
First Prev 331 332 333 334 335 336 337 338 339 340 Next Last
25.0 PACKAGING INFORMATION
25.1 Package Marking Information
28-Lead SPDIP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
28-Lead SOIC
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
28-Lead SSOP
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
28-Lead QFN
XXXXXXXX
XXXXXXXX
YYWWNNN
PIC18F45J10 FAMILY
Example
PIC18F24J10
-I/SP e3
0710017
Example
PIC18F24J10-I/SO e3
0710017
Example
PIC18F24J10
-I/SS e3
0710017
Example
18F24J10
-I/ML e3
0710017
Legend:
XX...X
Y
YY
WW
NNN
e3
*
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2007 Microchip Technology Inc.
Preliminary
DS39682C-page 331

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