PIC18LF45J10T-I/SP View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC18LF45J10T-I/SP

28/40/44-Pin High-Performance RISC Microcontrollers with nanoWatt Technology

Microchip Technology 

PIC18F45J10 FAMILY

25.2 Package Details

The following sections give the technical details of the packages.

28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

N

NOTE 1

1 23

D

A

A1

b1

b

E1

A2

L

e

E

c

eB

Units

INCHES

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

28

Pitch

e

.100 BSC

Top to Seating Plane

A

–

–

.200

Molded Package Thickness

A2

.120

.135

.150

Base to Seating Plane

A1

.015

–

–

Shoulder to Shoulder Width

E

.290

.310

.335

Molded Package Width

E1

.240

.285

.295

Overall Length

D

1.345

1.365

1.400

Tip to Seating Plane

L

.110

.130

.150

Lead Thickness

c

.008

.010

.015

Upper Lead Width

b1

.040

.050

.070

Lower Lead Width

b

.014

.018

.022

Overall Row Spacing §

eB

–

–

.430

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-070B

© 2007 Microchip Technology Inc.

Preliminary

DS39682C-page 333

Share Link: