PIC18(L)F2X/4XK22
27.2 DC Characteristics: Power-Down Current, PIC18(L)F2X/4XK22 (Continued)
PIC18LF2X/4XK22
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
PIC18F2X/4XK22
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No.
Device Characteristics
Typ Typ Max Max
+25°C +60°C +85°C +125°C
Units
VDD
Conditions
Notes
D010 High/Low Voltage Detect (2) 13.00
A 1.8V
13.00
A 3.0V
13.00
A 1.8V
13.00
A 3.0V
D011 Secondary Oscillator (3)
13.00
0.50
A 5.0V
A 1.8V
0.70
A
3.0V 32 kHz on SOSC
0.50
A 1.8V Low-Power mode
0.70
A 3.0V
D012 Secondary Oscillator (4)
0.70
11
A 5.0V
A 1.8V
17
A
3.0V 32 kHz on SOSC
11
A 1.8V High-Power mode
17
A 3.0V
17
D013 A/D Converter (5)
200
A 5.0V
A 1.8V
260
A
3.0V A/D on, not converting
200
A 1.8V Adder for FRC
260
A 3.0V
260
D014 A/D Converter (5)
A 5.0V
A 1.8V
A
3.0V A/D Conversion in
A 1.8V progress
A 3.0V
A 5.0V
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: BOR and HLVD enable inernal band gap reference. With both modules enabled, current consumption will
be less than the sum of both specifications
3: Low-Power mode on T1 osc: Low-Power mode is limited to 85°C.
4: High-Power mode is SOSC.
5: A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the
FRC turn off as soon as conversion (if any) is complete.
2010 Microchip Technology Inc.
Preliminary
DS41412A-page 427