PIC18LF2610-I/ML View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC18LF2610-I/ML

28/40/44-Pin Flash Microcontrollers with 10-Bit A/D and nanoWatt Technology

Microchip Technology 

PIC18F2X1X/4X1X

28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]

with 0.55 mm Contact Length

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

EXPOSED

D2

PAD

N

TOP VIEW

E

2

1

E2

2

1

NOTE 1

N

L

BOTTOM VIEW

e

b

K

A

A3

A1

Number of Pins

Units

Dimension Limits

N

MILLIMETERS

MIN

NOM

MAX

28

Pitch

Overall Height

Standoff

e

0.65 BSC

A

0.80

0.90

1.00

A1

0.00

0.02

0.05

Contact Thickness

Overall Width

Exposed Pad Width

A3

0.20 REF

E

6.00 BSC

E2

3.65

3.70

4.20

Overall Length

Exposed Pad Length

Contact Width

Contact Length

D

6.00 BSC

D2

3.65

3.70

4.20

b

0.23

0.30

0.35

L

0.50

0.55

0.70

Contact-to-Exposed Pad

K

0.20

–

–

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package is saw singulated.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-105B

© 2007 Microchip Technology Inc.

Preliminary

DS39636C-page 355

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