PIC18F258T-I/SP View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC18F258T-I/SP
Microchip Technology
PIC18F258T-I/SP Datasheet PDF : 402 Pages
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PIC18FXX8
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
#leads=n1
p
D1 D
2
1
B
n
CH x 45°
α
A
c
φ
β
A1
A2
L
F
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
44
44
Pitch
p
.031
0.80
Pins per Side
n1
11
11
Overall Height
A
.039
.043
.047
1.00
1.10
1.20
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
1.05
Standoff
A1
.002
.004
.006
0.05
0.10
0.15
Foot Length
L
.018
.024
.030
0.45
0.60
0.75
Footprint (Reference)
Foot Angle
F
.039 REF.
1.00 REF.
φ
0
3.5
7
0
3.5
7
Overall Width
E
.463
.472
.482
11.75
12.00
12.25
Overall Length
D
.463
.472
.482
11.75
12.00
12.25
Molded Package Width
E1
.390
.394
.398
9.90
10.00
10.10
Molded Package Length
D1
.390
.394
.398
9.90
10.00
10.10
Lead Thickness
c
.004
.006
.008
0.09
0.15
0.20
Lead Width
B
.012
.015
.017
0.30
0.38
0.44
Pin 1 Corner Chamfer
CH
.025
.035
.045
0.64
0.89
1.14
Mold Draft Angle Top
α
5
10
15
5
10
15
Mold Draft Angle Bottom
β
5
10
15
5
10
15
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MS-026
Drawing No. C04-076
Revised 07-22-05
© 2006 Microchip Technology Inc.
DS41159E-page 383
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