PIC32MX130F064C-40V/SO View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC32MX130F064C-40V/SO

32-bit Microcontrollers (up to 256 KB Flash and 64 KB SRAM) with Audio and Graphics Interfaces, USB, and Advanced Analog

Microchip Technology 

PIC32MX1XX/2XX

FIGURE 2-1:

RECOMMENDED

MINIMUM CONNECTION

Tantalum or

VDD ceramic 10 µF

ESR ≤ 3Ω(3)

R

R1

MCLR

0.1 µF

Ceramic

C

VSS

VDD

0.1 µF

Ceramic

Connect(2)

L1(2)

PIC32

VUSB3V3(1)

VDD

VSS

0.1 µF

Ceramic

0.1 µF

Ceramic

0.1 µF

Ceramic

Note 1:

2:

If the USB module is not used, this pin must be

connected to VDD.

As an option, instead of a hard-wired connection, an

inductor (L1) can be substituted between VDD and

AVDD to improve ADC noise rejection. The inductor

impedance should be less than 1Ω and the inductor

capacity greater than 10 mA.

Where:

f

=

F-----C---N----V-

2

(i.e., ADC conversion rate/2)

f = -----------1------------

(2π LC)

L

=

⎛

⎝

(---2---π----f1------C-----)⎠⎞

2

3: Aluminum or electrolytic capacitors should not be

used. ESR ≤ 3W from -40ºC to 125ºC @ SYSCLK

frequency (i.e., MIPS).

2.2.1 BULK CAPACITORS

The use of a bulk capacitor is recommended to improve

power supply stability. Typical values range from 4.7 µF

to 47 µF. This capacitor should be located as close to

the device as possible.

2.3 Capacitor on Internal Voltage

Regulator (VCAP)

2.3.1 INTERNAL REGULATOR MODE

A low-ESR (1 Ohm) capacitor is required on the VCAP

pin, which is used to stabilize the internal voltage regu-

lator output. The VCAP pin must not be connected to

VDD, and must have a CEFC capacitor, with at least a

6V rating, connected to ground. The type can be

ceramic or tantalum. Refer to Section 29.0 “Electrical

Characteristics” for additional information on CEFC

specifications.

2.4 Master Clear (MCLR) Pin

The MCLR pin provides for two specific device

functions:

• Device Reset

• Device programming and debugging

Pulling The MCLR pin low generates a device Reset.

Figure 2-2 illustrates a typical MCLR circuit. During

device programming and debugging, the resistance

and capacitance that can be added to the pin must

be considered. Device programmers and debuggers

drive the MCLR pin. Consequently, specific voltage

levels (VIH and VIL) and fast signal transitions must

not be adversely affected. Therefore, specific values

of R and C will need to be adjusted based on the

application and PCB requirements.

For example, as illustrated in Figure 2-2, it is

recommended that the capacitor C, be isolated from

the MCLR pin during programming and debugging

operations.

Place the components illustrated in Figure 2-2 within

one-quarter inch (6 mm) from the MCLR pin.

FIGURE 2-2:

VDD

MCLR PIN CONNECTIONS

R 10k R1(1)

0.1 µF(2)

C 1 kΩ

1

5

4

2

3

6

VDD

VSS

NC

MCLR

PIC32

PGECx(3)

PGEDx(3)

Note 1:

2:

3:

470Ω ≤ R1 ≤ 1Ω will limit any current flowing into

MCLR from the external capacitor C, in the event of

MCLR pin breakdown, due to Electrostatic Discharge

(ESD) or Electrical Overstress (EOS). Ensure that the

MCLR pin VIH and VIL specifications are met without

interfering with the Debug/Programmer tools.

The capacitor can be sized to prevent unintentional

Resets from brief glitches or to extend the device

Reset period during POR.

No pull-ups or bypass capacitors are allowed on

active debug/program PGECx/PGEDx pins.

2.5 ICSP Pins

The PGECx and PGEDx pins are used for In-Circuit

Serial Programming™ (ICSP™) and debugging pur-

poses. It is recommended to keep the trace length

between the ICSP connector and the ICSP pins on the

device as short as possible. If the ICSP connector is

expected to experience an ESD event, a series resistor

is recommended, with the value in the range of a few

tens of Ohms, not to exceed 100 Ohms.

DS60001168F-page 28

© 2011-2014 Microchip Technology Inc.

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