PIC16LC72-04IP View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16LC72-04IP

8-Bit CMOS Microcontrollers with A/D Converter

Microchip Technology 

PIC16C7X

Applicable Devices 72 73 73A 74 74A 76 77

20.2 DC Characteristics: PIC16LC76/77-04 (Commercial, Industrial)

DC CHARACTERISTICS

Param

No.

Characteristic

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40˚C ≤ TA ≤ +85˚C for industrial and

0˚C ≤ TA ≤ +70˚C for commercial

Sym Min Typ† Max Units

Conditions

D001 Supply Voltage

VDD 2.5 - 6.0 V LP, XT, RC osc configuration (DC - 4 MHz)

D002* RAM Data Retention

VDR

- 1.5 - V

Voltage (Note 1)

D003 VDD start voltage to

VPOR - VSS -

ensure internal Power-on

Reset signal

V See section on Power-on Reset for details

D004* VDD rise rate to ensure SVDD 0.05 -

internal Power-on Reset

signal

- V/ms See section on Power-on Reset for details

D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN bit in configuration word enabled

D010 Supply Current (Note 2,5) IDD

- 2.0 3.8 mA XT, RC osc configuration

FOSC = 4 MHz, VDD = 3.0V (Note 4)

D010A

- 22.5 48 µA LP osc configuration

FOSC = 32 kHz, VDD = 3.0V, WDT disabled

D015* Brown-out Reset Current ∆IBOR - 350 425 µA BOR enabled VDD = 5.0V

(Note 6)

D020 Power-down Current

IPD

D021 (Note 3,5)

D021A

- 7.5 30 µA VDD = 3.0V, WDT enabled, -40°C to +85°C

- 0.9 5 µA VDD = 3.0V, WDT disabled, 0°C to +70°C

- 0.9 5 µA VDD = 3.0V, WDT disabled, -40°C to +85°C

D023* Brown-out Reset Current ∆IBOR - 350 425 µA BOR enabled VDD = 5.0V

(Note 6)

* These parameters are characterized but not tested.

† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: This is the limit to which VDD can be lowered without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD

MCLR = VDD; WDT enabled/disabled as specified.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-

mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.

5: Timer1 oscillator (when enabled) adds approximately 20 µA to the specification. This value is from charac-

terization and is for design guidance only. This is not tested.

6: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be

added to the base IDD or IPD measurement.

DS30390E-page 222

© 1997 Microchip Technology Inc.

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